Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.
1～6 item / All 6 items
Production of semiconductor packages based on materials science.
We have over 15 years of experienced professional engineers in development and production, meeting customer needs. We develop standard butterfly packages for optical communication and supply high-quality optoelectronic components, such as BTF-PKG, mini-DIL-PKG, and subcomponents that meet MIL standard 883E, at low costs.
A semiconductor package that supports miniaturization and high density through unique cavity structure formation technology.
Our "Semiconductor Package (EBGA)" responds to miniaturization and high density through the adoption of unique cavity structure formation technology, fine pattern formation technology, and electroless gold plating technology. Using our proprietary method, we manufacture packages with a three-dimensional cavity structure. It is also possible to directly replace the cavity structure of a ceramic substrate with a glass-epoxy substrate. Furthermore, by implementing functional components in the cavity section, internal component embedding is possible. This allows for shorter signal propagation distances, making it effective for high-speed processing. 【Features】 ■ Unique cavity formation technology ■ Supports miniaturization and high density ■ Effective for high-speed processing ■ Can use the substrate surface as the mounting surface in combination with build-up ■ Produces high-speed processing packages by bonding metal heat spreaders *For more details, please refer to the catalog or feel free to contact us.
We contribute to miniaturization of products through 3D implementation technologies such as PoP (Package on Package) implementation.
PoP technology is adopted in products that require miniaturization and high density, such as smartphones and digital still cameras, and our company has achieved a cumulative production record of over 100 million units to date. Additionally, we possess technologies for stacking substrates beyond PoP, enabling us to respond to product miniaturization. 【Features】 ■ By stacking two semiconductor packages, it is possible to reduce the footprint on the substrate. ■ By using wiring between the upper and lower packages, we can shorten the wiring length compared to wiring on the substrate, enabling high-speed wiring. ■ By using tested packages with guaranteed quality, we can reduce the failure rate compared to SiP. ■ We can also accommodate substrate stacking beyond PoP. *For more details, please refer to the PDF document or feel free to contact us.
![[Data] WTI Blog January 2022](https://image.mono.ipros.com/public/product/image/2e9/2000686771/IPROS86311445361732062134.jpeg?w=280&h=280)
Introduction of necessary items for semiconductor package assembly and examples of inquiries from substrate manufacturers.
This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" to solve the shortage of engineers, from January 11, 2022, to January 25, 2022. It introduces topics such as "What is needed for assembling semiconductor packages" from January 11, 2022, "Inquiry case studies from substrate manufacturers" from January 18, 2022, and "The birth of WTI's navigation character 'Namirin's' Air POP balloon!" from January 25, 2021. In addition, we have published a wealth of useful information related to products and industries. We encourage you to read it. [Contents] ■ January 11, 2022 "What is needed for assembling semiconductor packages" ~ Printed Circuit Board Design Edition ~ ■ January 18, 2022 Inquiry case studies from substrate manufacturers ~ Substrate design also requires adjustments that align with the manufacturing processes of substrate manufacturers ~ ■ January 25, 2021 The birth of WTI's navigation character "Namirin's" Air POP balloon! *For more details, please refer to the PDF document or feel free to contact us.
New structure ultra-low profile package! Development and provision planned using proprietary technology.
The "Ultra Low Profile Package" is a product that achieves ultra low profile and low resistance wiring through a structure that does not use conventional Cu frames or interposers such as PCBs. We plan to develop and provide the ultra low profile package with a new package structure using our unique technology. 【Features】 ■ Development and provision of ultra low profile packages using unique technology ■ Structure that does not use conventional Cu frames or interposers such as PCBs ■ Ultra low profile and low resistance wiring package ■ Dimple processing at the terminal area *For more details, please refer to the PDF materials or feel free to contact us.
Package using patented technology! Formation of solder fillet through special processing.
The Cu frame type "Package with Via Holes" is a package that enables the reliable formation of solder fillets due to special processing at the terminal parts. It utilizes patented technology to achieve high soldering quality and improve the appearance inspection after mounting. In standard non-leaded packages, the exposed parts of the lead frame terminals are prone to oxidation, which reduces solder wettability. However, by forming via holes, solder can spread from the plated areas of the via holes, making it suitable for automotive packages with reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ Achievement of high soldering quality and improved appearance inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.
